Here is a selection of applications done with this technology in both the medical as well as the semicon packaging field.
Laser hole drilling machine.
For through holes in small workpiece thicknesses single pulse processes can be used.
For large diameters trepanning drilling a combined drilling cutting process or the multi pass method are used.
For thicker materials percussion drilling is first choice and with which the required depth can be achieved by applying several laser pulses.
Potomac is continually developing and adding new hole drilling processes to our facility.
The drilling time must be short enough so that laser drilling can compete with conventional drilling methods edm and punching.
Lasers can be used to drill holes in many different applications across all industries.
The diameter of these holes can be as small as 0 002 50 μm.
Laser drilling is a non contact process that uses focused high energy density light to ablate material and drill holes in a wide variety of materials.
The quality requirements are very high for micro drilling in particular.
One of the process in stent manufacturing is hole drilling of the tube holder.
Compared to other drilling methods lasers offer superior speed and precision while lowering operating costs.
Laser drilling of stent tube.
If larger holes are required the laser is moved around the circumference of the popped hole until the desired diameter is created.
Time quality flexibility and reproducibility.